Home Subscription Services
 
   

 
Quintessence International
QI Home Page
About the Editor
Editorial Board
Accepted Manuscripts
Submit
Author Guidelines
Submission Form
Reprints / Articles
Permissions
Advertising
MEDLINE Search
 
 
 
 
 
FacebookTwitterYouTube
Quintessence Publishing: Journals: QI
Quintessence International

Edited by Eli Eliav

ISSN 0033-6572 (print) • ISSN 1936-7163 (online)

Publication:
January 1991
Volume 22 , Issue 1

Back
Share Abstract:

Resin-to-enamel bond strengths with various etching times

Gilpatrick/Ross/Simonsen

Pages: 47-49
PMID: 1784719

It has been advocated recently that etching times of enamel be reduced from 60 seconds to as low as 15 seconds. However, the minimal etching time needed to achieve adequate retention of composite resin to enamel has not been identified. In this study, an attempt was made to find the minimal enamel-etching time that still allowed adequate bond strength of composite resin to enamel surfaces. Adequate bond strength was defined as equivalent to the bond strength established for the conventional 60-second etch. Results seemed to indicate that a 5-second etch was sufficient to allow adequate bond strength; however, further study is required to determine the effects of short etching times on microleakage.

Full Text PDF File | Order Article

 

Get Adobe Reader
Adobe Acrobat Reader is required to view PDF files. This is a free program available from the Adobe web site.
Follow the download directions on the Adobe web site to get your copy of Adobe Acrobat Reader.
  © 2014 Quintessence Publishing Co Inc
 

Home | Subscription Services | Books | Journals | Multimedia | Events | Blog
Terms of Use | Privacy Policy | About Us | Contact Us | Advertising | Help | Sitemap | Catalog