Home Subscription Services
 
   

 
The Journal of Adhesive Dentistry
JAD Home Page
About the Editor
Editorial Board
Submit
Author Guidelines
Submission Form
Reprints / Articles
Permissions
Advertising
Advertising
MEDLINE Search
 
 
 
 
 
FacebookTwitter
Quintessence Publishing: Journals: JAD

 

The Journal of Adhesive Dentistry

Edited by Jean-François Roulet

ISSN (print) 1461-5185 • ISSN (online) 1757-9988

Publication:

May/June 2008
Volume 10 , Issue 3



Pages: 173-182
Back
Share Abstract:

Effect of Dentinal Surface Preparation on Bond Strength of Self-etching Adhesives

Yiu, Cynthia K. Y. / Hiraishi, Noriko / King, Nigel M. / Tay, Franklin R.

Purpose: This study examined the effects of cutting dentin with different burs at various speeds on the microtensile bond strength (μTBS) of two self-etching adhesive systems. Materials and Methods: Flat deep dentin surfaces from 50 extracted human third molars were divided into 5 groups (n = 10) according to bur type and speed of rotation: (I) high-speed diamond bur, (II) low-speed diamond bur, (III) highspeed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with 600-grit SiC paper. A two-step self-etching adhesive, Clearfil SE Bond (SE, Kuraray) and a one-step self-etching adhesive, Clearfil S3 Bond (S3, Kuraray) were applied to dentin surfaces and light cured. Composite buildups were performed using Filtek Z250 (3M ESPE). For μTBS evaluation, composite-dentin beams of 0.8 mm2 were stressed to failure at a crosshead speed of 1 mm/min. The μTBS data were analyzed using two-way ANOVA and Tukey’s multiple comparison tests. Representative fractured beams from each group were prepared for fractographic analysis under SEM. Results: Two-way ANOVA showed that the effects of dentin surface preparations, adhesive systems, and their interaction were statistically significant (p < 0.001). The μTBS was the highest when bonding SE to dentin surface prepared with 600-grit SiC abrasive paper (47.3 7.4 MPa), followed by high-speed tungsten carbide burs (40.8 6.1 MPa), and the lowest when bonding S3 to dentin surfaces prepared with a high-speed diamond bur (15.2 6.2 MPa). SEM observation of the fractured surfaces revealed mixed and adhesive failures for SE groups, while in the S3 groups, adhesive failures predominated with numerous inclusion droplets. Conclusion: Higher bond strengths are achieved with SE bond when applied on dentin surfaces prepared with tungsten carbide burs. Proper bur and adhesive selection are essential to optimize dentin adhesion of self-etching adhesives.

Keywords: surface preparation, microtensile bond strength, self-etching adhesive, dentin

Full Text PDF File | Order Article

 

 
  © 2014 Quintessence Publishing Co Inc
 

Home | Subscription Services | Books | Journals | Multimedia | Events | Blog
Terms of Use | Privacy Policy | About Us | Contact Us | Advertising | Help | Sitemap | Catalog